Inventor
ROSSI NIC
HK6 patents
⚠️ This page may combine multiple inventors who share the name “ROSSI NIC”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WARREN ROBERT W
5 patentsUS9029991B2May 12, 2015
Semiconductor packages with reduced solder voiding
WARREN ROBERT W7 citations82
US8455990B2Jun 4, 2013
Systems and methods of tamper proof packaging of a semiconductor device
WARREN ROBERT W11 citations82
US8552540B2Oct 8, 2013
Wafer level package with thermal pad for higher power dissipation
WARREN ROBERT W3 citations60
US8540529B2Sep 24, 2013
Shielded USB connector module with molded hood and LED light pipe
WARREN ROBERT W4 citations60
US9230928B2Jan 5, 2016
Spot plated leadframe and IC bond pad via array design for copper wire
WARREN ROBERT W0 citations50