Inventor

LEE GYU JEI

KR5 patents

⚠️ This page may combine multiple inventors who share the name “LEE GYU JEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SK HYNIX INC

3 patents

US10393646B2Aug 27, 2019

Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same

SK HYNIX INC0 citations47

US9945772B2Apr 17, 2018

Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same

SK HYNIX INC0 citations47

US11569216B2Jan 31, 2023

Semiconductor package including stacked semiconductor chips and method for fabricating the semiconductor package

SK HYNIX INC0 citations44

KIM HYUN JOO

1 patent

US8829657B2Sep 9, 2014

Semiconductor substrate, semiconductor chip having the same, and stacked semiconductor package

KIM HYUN JOO5 citations70

LEE GYU JEI

1 patent

US8878349B2Nov 4, 2014

Semiconductor chip and stacked semiconductor package having the same

LEE GYU JEI1 citations44