Inventor

NISHIDONO KYOKO

JP2 patents

Patents

2 patents

US11244878B2Feb 8, 2022

Semiconductor chip-encapsulating resin composition containing epoxy resin, and semiconductor package including a cured product of the semiconductor-chip-encapsulating resin composition

PANASONIC IP MAN CO LTD0 citations52

US9633922B2Apr 25, 2017

Sealing epoxy resin composition, hardened product, and semiconductor device

PANASONIC IP MAN CO LTD1 citations39