Inventor

IWATANI EMI

JP2 patents

Patents

2 patents

US9633922B2Apr 25, 2017

Sealing epoxy resin composition, hardened product, and semiconductor device

PANASONIC IP MAN CO LTD1 citations39

US9932473B2Apr 3, 2018

Encapsulating resin composition, semiconductor device using the encapsulating resin composition, and method for manufacturing semiconductor device using the encapsulating resin composition

PANASONIC IP MAN CO LTD0 citations36