Inventor
CUMBIE MICHAEL W
US227 patents
⚠️ This page may combine multiple inventors who share the name “CUMBIE MICHAEL W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
39 patentsUS10107667B2Oct 23, 2018
Liquid level indicating
HEWLETT PACKARD DEVELOPMENT CO46 citations98
US10875318B1Dec 29, 2020
Logic circuitry
HEWLETT PACKARD DEVELOPMENT CO31 citations97
US11034157B2Jun 15, 2021
Logic circuitry
HEWLETT PACKARD DEVELOPMENT CO29 citations94
US10894423B2Jan 19, 2021
Logic circuitry
HEWLETT PACKARD DEVELOPMENT CO29 citations94
US9944080B2Apr 17, 2018
Molded fluid flow structure
HEWLETT PACKARD DEVELOPMENT CO13 citations93
US10022962B1Jul 17, 2018
Fluidic die
HEWLETT PACKARD DEVELOPMENT CO15 citations92
US11364719B2Jun 21, 2022
Print component with memory array using intermittent clock signal
HEWLETT PACKARD DEVELOPMENT CO7 citations86
US11141973B2Oct 12, 2021
Integrated circuits including memory cells
HEWLETT PACKARD DEVELOPMENT CO4 citations84
US10940693B1Mar 9, 2021
Logic circuitry
HEWLETT PACKARD DEVELOPMENT CO3 citations84
USD857230SAug 20, 2019
Cassette
HEWLETT PACKARD DEVELOPMENT CO13 citations84
US9895888B2Feb 20, 2018
Fluid flow structure
HEWLETT PACKARD DEVELOPMENT CO5 citations84
US8348373B2Jan 8, 2013
Firing signal forwarding in a fluid ejection device
HEWLETT PACKARD DEVELOPMENT CO8 citations84
US10232619B2Mar 19, 2019
Printhead with bond pad surrounded by dam
HEWLETT PACKARD DEVELOPMENT CO5 citations83
US11666908B2Jun 6, 2023
Microfluidic package
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US11577456B2Feb 14, 2023
Molded panels
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US11559985B2Jan 24, 2023
Integrated circuit with address drivers for fluidic die
HEWLETT PACKARD DEVELOPMENT CO3 citations73
US11479046B2Oct 25, 2022
Logic circuitry for sensor data communications
HEWLETT PACKARD DEVELOPMENT CO1 citations73
US11440008B2Sep 13, 2022
Microfluidic device with capillary chamber
HEWLETT PACKARD DEVELOPMENT CO3 citations73
US11413864B2Aug 16, 2022
Die for a printhead
HEWLETT PACKARD DEVELOPMENT CO3 citations73
US11413865B2Aug 16, 2022
Fluid ejection devices including contact pads
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US11292257B2Apr 5, 2022
Molded die slivers with exposed front and back surfaces
HEWLETT PACKARD DEVELOPMENT CO1 citations73
US11292265B2Apr 5, 2022
Fluid circulation and ejection
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US11186090B2Nov 30, 2021
Fluid ejection device
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US11065883B2Jul 20, 2021
Cross-die recirculation channels and chamber recirculation channels
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US11046084B2Jun 29, 2021
Liquid level sensing
HEWLETT PACKARD DEVELOPMENT CO6 citations73
US11020967B2Jun 1, 2021
Printhead
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US10960658B2Mar 30, 2021
Detecting a level of printable fluid in a container
HEWLETT PACKARD DEVELOPMENT CO3 citations73
US10940694B2Mar 9, 2021
Detecting fluid levels using a variable threshold voltage
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US10926548B2Feb 23, 2021
Printing apparatus and methods for detecting fluid levels
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US10589522B2Mar 17, 2020
Fluidic die
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US10576748B2Mar 3, 2020
Fluid reservoir with fluid property and level detection
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US10245830B2Apr 2, 2019
Printing system with a fluid circulating element
HEWLETT PACKARD DEVELOPMENT CO4 citations73
US10226926B2Mar 12, 2019
Printbars and methods of forming printbars
HEWLETT PACKARD DEVELOPMENT CO4 citations73
US10207500B2Feb 19, 2019
Print head interposers
HEWLETT PACKARD DEVELOPMENT CO3 citations73
US10029467B2Jul 24, 2018
Molded printhead
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US9919525B2Mar 20, 2018
Printed circuit board fluid ejection apparatus
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US9919524B2Mar 20, 2018
Printhead with bond pad surrounded by dam
HEWLETT PACKARD DEVELOPMENT CO4 citations72
US11712896B2Aug 1, 2023
Nozzle arrangements and supply channels
HEWLETT PACKARD DEVELOPMENT CO2 citations71
US11305537B2Apr 19, 2022
Nozzle arrangements and supply channels
HEWLETT PACKARD DEVELOPMENT CO4 citations71
HEWLETT PACKARD DEVELOPMENT CO LP
10 patentsUS9724920B2Aug 8, 2017
Molded die slivers with exposed front and back surfaces
HEWLETT PACKARD DEVELOPMENT CO LP14 citations93
US9844946B2Dec 19, 2017
Molded printhead
HEWLETT PACKARD DEVELOPMENT CO LP6 citations84
US9770909B2Sep 26, 2017
Printhead dies molded with nozzle health sensor
HEWLETT PACKARD DEVELOPMENT CO LP5 citations84
US9731509B2Aug 15, 2017
Fluid structure with compression molded fluid channel
HEWLETT PACKARD DEVELOPMENT CO LP10 citations84
US9446587B2Sep 20, 2016
Molded printhead
HEWLETT PACKARD DEVELOPMENT CO LP17 citations84
US10739181B2Aug 11, 2020
Liquid level indicating
HEWLETT PACKARD DEVELOPMENT CO LP4 citations73
US9751319B2Sep 5, 2017
Printing fluid cartridge
HEWLETT PACKARD DEVELOPMENT CO LP2 citations73
US9676192B2Jun 13, 2017
Printbar and method of forming same
HEWLETT PACKARD DEVELOPMENT CO LP2 citations73
US9656469B2May 23, 2017
Molded fluid flow structure with saw cut channel
HEWLETT PACKARD DEVELOPMENT CO LP3 citations73
US9539814B2Jan 10, 2017
Molded printhead
HEWLETT PACKARD DEVELOPMENT CO LP4 citations73
WEI QINGQIAO
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