Inventor
CHAN YU-CHEN
TW20 patents
Patents
20 patentsUS10141260B1Nov 27, 2018
Interconnection structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US11081447B2Aug 3, 2021
Graphene-assisted low-resistance interconnect structures and methods of formation thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10741493B2Aug 11, 2020
Interconnection structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11309241B2Apr 19, 2022
Protection liner on interconnect wire to enlarge processing window for overlying interconnect via
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12525538B2Jan 13, 2026
Semiconductor device structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12525531B2Jan 13, 2026
Protection liner on interconnect wire to enlarge processing window for overlying interconnect via
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12211740B2Jan 28, 2025
Interconnect structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12113021B2Oct 8, 2024
Graphene-assisted low-resistance interconnect structures and methods of formation thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12068254B2Aug 20, 2024
Interconnection structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12051645B2Jul 30, 2024
Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11908794B2Feb 20, 2024
Protection liner on interconnect wire to enlarge processing window for overlying interconnect via
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11710700B2Jul 25, 2023
Graphene-assisted low-resistance interconnect structures and methods of formation thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11670595B2Jun 6, 2023
Semiconductor device structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11640940B2May 2, 2023
Methods of forming interconnection structure including conductive graphene layers
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11532549B2Dec 20, 2022
Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11011467B2May 18, 2021
Method of forming interconnection structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11948837B2Apr 2, 2024
Semiconductor structure having vertical conductive graphene and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12417981B2Sep 16, 2025
Semiconductor device including graphene interconnect and method of making the semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12068253B2Aug 20, 2024
Semiconductor structure with two-dimensional conductive structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12027419B2Jul 2, 2024
Semiconductor device including liner structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48