Inventor

DING ZHICHENG

CN17 patents

⚠️ This page may combine multiple inventors who share the name “DING ZHICHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DING ZHICHENG

INTEL CORP

Method, apparatus and system to interconnect packaged integrated circuit dies

Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same

Die stack with reduced warpage

Stair-stacked dice device in a system in package, and methods of making same

Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same

Stair-stacked dice device in a system in package, and methods of making same

Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same

Method, apparatus and system to interconnect packaged integrated circuit dies

Film in substrate for releasing z stack-up constraint

Power enhanced stacked chip scale package solution with integrated die attach film

Interconnect structure fabricated using lithographic and deposition processes

Power enhanced stacked chip scale package solution with integrated die attach film

Die stack with reduced warpage

Joint connection of corner non-critical to function (NCTF) ball for BGA solder joint reliability (SJR) enhancement

Electronic device package

Flip-chip like integrated passive prepackage for SIP device

SHANGHAI ZHONGLIAN TECH LTD CO

Input device for intelligent terminal