Inventor
MAKI KAZUNARI
JP45 patents
⚠️ This page may combine multiple inventors who share the name “MAKI KAZUNARI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI MATERIALS CORP
36 patentsUS10294547B2May 21, 2019
Copper alloy for electronic and electrical equipment, plastically worked copper alloy material for electronic and electrical equipment, and component and terminal for electronic and electrical equipment
MITSUBISHI MATERIALS CORP2 citations73
US10157694B2Dec 18, 2018
Copper alloy for electronic/electric device, copper alloy plastic working material for electronic/electric device, and component and terminal for electronic/electric device
MITSUBISHI MATERIALS CORP4 citations73
US8951369B2Feb 10, 2015
Copper alloy for electronic/electric device, copper alloy thin plate for electronic/electric device, method of producing copper alloy for electronic/electric device, conductive component for electronic/electric device and terminal
MITSUBISHI MATERIALS CORP4 citations73
US10676803B2Jun 9, 2020
Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
MITSUBISHI MATERIALS CORP4 citations72
US10453582B2Oct 22, 2019
Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
MITSUBISHI MATERIALS CORP4 citations72
US10128019B2Nov 13, 2018
Copper alloy for electronic/electrical device, plastically-worked copper alloy material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
MITSUBISHI MATERIALS CORP4 citations72
US9938606B2Apr 10, 2018
Hot-rolled copper plate
MITSUBISHI MATERIALS CORP2 citations67
US11319615B2May 3, 2022
Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay
MITSUBISHI MATERIALS CORP0 citations62
US11203806B2Dec 21, 2021
Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay
MITSUBISHI MATERIALS CORP1 citations62
US11613794B2Mar 28, 2023
Superconductivity stabilizing material, superconducting wire and superconducting coil
MITSUBISHI MATERIALS CORP0 citations61
US11149329B2Oct 19, 2021
Stabilizer material for superconductor
MITSUBISHI MATERIALS CORP0 citations61
US10971278B2Apr 6, 2021
Superconducting wire and superconducting coil
MITSUBISHI MATERIALS CORP0 citations61
US10964454B2Mar 30, 2021
Superconducting wire and superconducting coil
MITSUBISHI MATERIALS CORP1 citations61
US10964453B2Mar 30, 2021
Superconducting stabilization material, superconducting wire, and superconducting coil
MITSUBISHI MATERIALS CORP0 citations61
US12281376B2Apr 22, 2025
Slit copper material, part for electric/electronic device, bus bar, heat dissipation substrate
MITSUBISHI MATERIALS CORP0 citations60
US11795525B2Oct 24, 2023
Copper alloy plate, copper alloy plate with plating film, and manufacturing method thereof
MITSUBISHI MATERIALS CORP0 citations60
US11104977B2Aug 31, 2021
Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar
MITSUBISHI MATERIALS CORP1 citations60
US12264407B2Apr 1, 2025
Cu—Ni—Si based copper alloy plate, Cu—Ni—Si based copper alloy plate with plating film, and methods of producing the same
MITSUBISHI MATERIALS CORP0 citations59
US11781234B2Oct 10, 2023
Copper alloy plate, plating film-attached copper alloy plate, and methods respectively for manufacturing these products
MITSUBISHI MATERIALS CORP0 citations59
US12286698B2Apr 29, 2025
Pure copper material, insulating substrate, and electronic device
MITSUBISHI MATERIALS CORP0 citations58
US12264390B1Apr 1, 2025
Pure copper material, insulating substrate, and electronic device
MITSUBISHI MATERIALS CORP0 citations58
US11920228B2Mar 5, 2024
Copper alloy sheet, copper alloy sheet with plating film, and method for producing same
MITSUBISHI MATERIALS CORP0 citations56
US10458003B2Oct 29, 2019
Copper alloy and copper alloy forming material
MITSUBISHI MATERIALS CORP0 citations52
US10190194B2Jan 29, 2019
Copper alloy for electronic and electrical equipment, copper alloy thin sheet for electronic and electrical equipment, and conductive component for electronic and electrical equipment, terminal
MITSUBISHI MATERIALS CORP0 citations52
US10153063B2Dec 11, 2018
Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices
MITSUBISHI MATERIALS CORP0 citations52
US10032536B2Jul 24, 2018
Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
MITSUBISHI MATERIALS CORP0 citations52
US9653191B2May 16, 2017
Copper alloy for electric and electronic device, copper alloy sheet for electric and electronic device, conductive component for electric and electronic device, and terminal
MITSUBISHI MATERIALS CORP1 citations52
US9587299B2Mar 7, 2017
Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment
MITSUBISHI MATERIALS CORP1 citations52
US12359284B2Jul 15, 2025
Copper alloy, plastically worked copper alloy material, component for electronic/electrical equipment, terminal, heat dissipation substrate
MITSUBISHI MATERIALS CORP0 citations50
US12203158B2Jan 21, 2025
Copper alloy, copper alloy plastic working material, component for electronic/electrical device, terminal, bus bar, lead frame, and heat dissipation substrate
MITSUBISHI MATERIALS CORP0 citations50
US11926889B2Mar 12, 2024
Copper alloy plate, copper alloy plate with plating film, and methods for producing these
MITSUBISHI MATERIALS CORP0 citations49
US11905614B2Feb 20, 2024
Terminal material for connector
MITSUBISHI MATERIALS CORP0 citations49
US11655523B2May 23, 2023
Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar
MITSUBISHI MATERIALS CORP0 citations49
US11572633B2Feb 7, 2023
Tin-plated copper terminal material and method of manufacturing the same
MITSUBISHI MATERIALS CORP0 citations48
US10392680B2Aug 27, 2019
Copper alloy for electric and electronic devices, copper alloy sheet for electric and electronic devices, component for electric and electronic devices, terminal, and bus bar
MITSUBISHI MATERIALS CORP0 citations45
US9496064B2Nov 15, 2016
Copper alloy for electric and electronic device, copper alloy sheet for electric and electronic device, conductive component for electric and electronic device, and terminal
MITSUBISHI MATERIALS CORP0 citations41
MAKI KAZUNARI
3 patentsUS9212419B2Dec 15, 2015
Sputtering target for forming wiring film of flat panel display
MAKI KAZUNARI1 citations47
US8658009B2Feb 25, 2014
Thin film transistor having a barrier layer as a constituting layer and Cu-alloy sputtering target used for sputter film formation of the barrier layer
MAKI KAZUNARI0 citations47
US8624397B2Jan 7, 2014
Electrode layer structure for a thin-film transistor and process for manufacture thereof
MAKI KAZUNARI0 citations46
TANAKA ELECTRONICS IND
2 patentsUS7857189B2Dec 28, 2010
Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, and high resin flowability resistance
TANAKA ELECTRONICS IND0 citations51
US7678999B2Mar 16, 2010
Gold alloy wire for bonding wire having high bonding reliability, high roundness of compression ball, high straightness and high resin flowability resistance
TANAKA ELECTRONICS IND0 citations51