Inventor
WU HENG
US194 patents
⚠️ This page may combine multiple inventors who share the name “WU HENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
44 patentsUS10229985B1Mar 12, 2019
Vertical field-effect transistor with uniform bottom spacer
IBM284 citations99
US10056289B1Aug 21, 2018
Fabrication of vertical transport fin field effect transistors with a self-aligned separator and an isolation region with an air gap
IBM44 citations98
US10566246B1Feb 18, 2020
Shared contact trench comprising dual silicide layers and dual epitaxial layers for source/drain layers of NFET and PFET devices
IBM41 citations95
US10985064B2Apr 20, 2021
Buried power and ground in stacked vertical transport field effect transistors
IBM19 citations94
US10797163B1Oct 6, 2020
Leakage control for gate-all-around field-effect transistor devices
IBM26 citations94
US10522649B2Dec 31, 2019
Inverse T-shaped contact structures having air gap spacers
IBM23 citations94
US10388569B1Aug 20, 2019
Formation of stacked nanosheet semiconductor devices
IBM16 citations94
US10243061B1Mar 26, 2019
Nanosheet transistor
IBM28 citations94
US10236364B1Mar 19, 2019
Tunnel transistor
IBM26 citations94
US10084094B1Sep 25, 2018
Wrapped source/drain contacts with enhanced area
IBM17 citations94
US10020381B1Jul 10, 2018
Embedded bottom metal contact formed by a self-aligned contact process for vertical transistors
IBM17 citations94
US10134859B1Nov 20, 2018
Transistor with asymmetric spacers
IBM16 citations93
US11362193B2Jun 14, 2022
Inverse T-shaped contact structures having air gap spacers
IBM7 citations86
US11251362B2Feb 15, 2022
Stacked spin-orbit-torque magnetoresistive random-access memory
IBM9 citations86
US11177258B2Nov 16, 2021
Stacked nanosheet CFET with gate all around structure
IBM15 citations86
US10957778B2Mar 23, 2021
Formation of air gap spacers for reducing parasitic capacitance
IBM4 citations84
US10930563B2Feb 23, 2021
Formation of stacked nanosheet semiconductor devices
IBM4 citations84
US10910470B1Feb 2, 2021
Nanosheet transistors with inner airgaps
IBM5 citations84
US10381262B2Aug 13, 2019
Fabrication of vertical transport fin field effect transistors with a self-aligned separator and an isolation region with an air gap
IBM6 citations84
US10332983B1Jun 25, 2019
Vertical field-effect transistors including uniform gate lengths
IBM8 citations84
US10249755B1Apr 2, 2019
Transistor with asymmetric source/drain overlap
IBM12 citations84
US9947767B1Apr 17, 2018
Self-limited inner spacer formation for gate-all-around field effect transistors
IBM7 citations83
US11944013B2Mar 26, 2024
Magnetic tunnel junction device with minimum stray field
IBM3 citations74
US11557651B2Jan 17, 2023
Nanosheet transistors with inner airgaps
IBM2 citations73
US11489009B2Nov 1, 2022
Integrating embedded memory on CMOS logic using thin film transistors
IBM2 citations73
US11380843B2Jul 5, 2022
Phase change memory using multiple stacks of PCM materials
IBM2 citations73
US11289573B2Mar 29, 2022
Contact resistance reduction in nanosheet device structure
IBM5 citations73
US11282838B2Mar 22, 2022
Stacked gate structures
IBM2 citations73
US11189713B2Nov 30, 2021
Nanosheet transistor having wrap-around bottom isolation
IBM3 citations73
US11189725B2Nov 30, 2021
VTFET with cell height constraints
IBM2 citations73
US11183577B2Nov 23, 2021
Formation of air gap spacers for reducing parasitic capacitance
IBM2 citations73
US11177369B2Nov 16, 2021
Stacked vertical field effect transistor with self-aligned junctions
IBM2 citations73
US11177367B2Nov 16, 2021
Self-aligned bottom spacer EPI last flow for VTFET
IBM2 citations73
US11164870B2Nov 2, 2021
Stacked upper fin and lower fin transistor with separate gate
IBM4 citations73
US11164791B2Nov 2, 2021
Contact formation for stacked vertical transport field-effect transistors
IBM3 citations73
US11158543B2Oct 26, 2021
Silicide formation for source/drain contact in a vertical transport field-effect transistor
IBM2 citations73
US11075334B2Jul 27, 2021
Spin-orbit-torque magneto-resistive random access memory with stepped bottom electrode
IBM4 citations73
US11069679B2Jul 20, 2021
Reducing gate resistance in stacked vertical transport field effect transistors
IBM4 citations73
US11037905B2Jun 15, 2021
Formation of stacked vertical transport field effect transistors
IBM3 citations73
US11024670B1Jun 1, 2021
Forming an MRAM device over a transistor
IBM3 citations73
US11011617B2May 18, 2021
Formation of a partial air-gap spacer
IBM4 citations73
US11004856B1May 11, 2021
Stacked vertical transistor memory cell with epi connections
IBM6 citations73
US10950492B2Mar 16, 2021
Fabrication of vertical transport fin field effect transistors with a self-aligned separator and an isolation region with an air gap
IBM3 citations73
US10943989B2Mar 9, 2021
Gate to source/drain leakage reduction in nanosheet transistors via inner spacer optimization
IBM3 citations73
TESSERA INC
2 patentsGEN ELECTRIC
1 patentWU HENG
1 patentSHENZHEN MAGNET TECH CO LTD
1 patentADEIA SEMICONDUCTOR SOLUTIONS LLC
1 patentShowing the top 50 of 194 patents by PatentIndex Score.