Inventor

TOBITA AKIHIRO

JP4 patents

⚠️ This page may combine multiple inventors who share the name “TOBITA AKIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RENESAS ELECTRONICS CORP

2 patents

US9293436B2Mar 22, 2016

Bonding wire to bonding pad

RENESAS ELECTRONICS CORP5 citations70

US8587135B2Nov 19, 2013

Semiconductor device having electrode/film opening edge spacing smaller than bonding pad/electrode edge spacing

RENESAS ELECTRONICS CORP0 citations50

MITSUBISHI HEAVY IND LTD

1 patent

US7784267B2Aug 31, 2010

Detonation engine and flying object provided therewith

MITSUBISHI HEAVY IND LTD30 citations86

WADA TAMAKI

1 patent

US8338288B2Dec 25, 2012

Method of manufacturing semiconductor device

WADA TAMAKI0 citations43