Inventor
LEE BYEONG CHAN
US68 patents
⚠️ This page may combine multiple inventors who share the name “LEE BYEONG CHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
40 patentsUS7074662B2Jul 11, 2006
Methods for fabricating fin field effect transistors using a protective layer to reduce etching damage
SAMSUNG ELECTRONICS CO LTD176 citations99
US7141856B2Nov 28, 2006
Multi-structured Si-fin
SAMSUNG ELECTRONICS CO LTD104 citations98
US6849520B2Feb 1, 2005
Method and device for forming an STI type isolation in a semiconductor device
SAMSUNG ELECTRONICS CO LTD38 citations95
US9153692B2Oct 6, 2015
Semiconductor device having a stress film on a side surface of a fin
SAMSUNG ELECTRONICS CO LTD40 citations93
US7320908B2Jan 22, 2008
Methods of forming semiconductor devices having buried oxide patterns
SAMSUNG ELECTRONICS CO LTD34 citations93
US7176067B2Feb 13, 2007
Methods of fabricating fin field effect transistors
SAMSUNG ELECTRONICS CO LTD23 citations93
US7071048B2Jul 4, 2006
Methods of fabricating fin field effect transistors having capping insulation layers
SAMSUNG ELECTRONICS CO LTD40 citations93
US9761719B2Sep 12, 2017
Semiconductor device having silicon-germanium source/drain regions with varying germanium concentrations
SAMSUNG ELECTRONICS CO LTD19 citations92
US7534686B2May 19, 2009
Multi-structured Si-fin and method of manufacture
SAMSUNG ELECTRONICS CO LTD26 citations92
US7535061B2May 19, 2009
Fin-field effect transistors (Fin-FETs) having protection layers
SAMSUNG ELECTRONICS CO LTD23 citations92
US7141456B2Nov 28, 2006
Methods of fabricating Fin-field effect transistors (Fin-FETs) having protection layers
SAMSUNG ELECTRONICS CO LTD16 citations92
US7122871B2Oct 17, 2006
Integrated circuit field effect transistors including channel-containing fin having regions of high and low doping concentrations
SAMSUNG ELECTRONICS CO LTD35 citations92
US6890823B2May 10, 2005
Methods of forming integrated circuits with thermal oxide layers on side walls of gate electrodes wherein the source and drain are higher than the gate electrode
SAMSUNG ELECTRONICS CO LTD28 citations92
US6660613B2Dec 9, 2003
Method and device for forming an STI type isolation in a semiconductor device
SAMSUNG ELECTRONICS CO LTD18 citations92
US7385237B2Jun 10, 2008
Fin field effect transistors with low resistance contact structures
SAMSUNG ELECTRONICS CO LTD24 citations91
US10388791B2Aug 20, 2019
Semiconductor device with adjacent source/drain regions connected by a semiconductor bridge, and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD8 citations84
US8039350B2Oct 18, 2011
Methods of fabricating MOS transistors having recesses with elevated source/drain regions
SAMSUNG ELECTRONICS CO LTD9 citations84
US8008698B2Aug 30, 2011
Semiconductor memory devices having vertical channel transistors and related methods
SAMSUNG ELECTRONICS CO LTD11 citations84
US7683405B2Mar 23, 2010
MOS transistors having recesses with elevated source/drain regions
SAMSUNG ELECTRONICS CO LTD12 citations84
US7642589B2Jan 5, 2010
Fin field effect transistors having capping insulation layers
SAMSUNG ELECTRONICS CO LTD9 citations84
US7521301B2Apr 21, 2009
Methods for fabricating integrated circuit field effect transistors including channel-containing fin having regions of high and low doping concentrations
SAMSUNG ELECTRONICS CO LTD10 citations84
US7394117B2Jul 1, 2008
Fin field effect transistors including epitaxial fins
SAMSUNG ELECTRONICS CO LTD9 citations84
US7268396B2Sep 11, 2007
Finfets having first and second gates of different resistivities
SAMSUNG ELECTRONICS CO LTD15 citations84
US7205609B2Apr 17, 2007
Methods of forming semiconductor devices including fin structures and related devices
SAMSUNG ELECTRONICS CO LTD10 citations84
US6900102B2May 31, 2005
Methods of forming double gate electrodes using tunnel and trench
SAMSUNG ELECTRONICS CO LTD13 citations84
US7338867B2Mar 4, 2008
Semiconductor device having contact pads and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations74
US9735158B2Aug 15, 2017
Semiconductor devices having bridge layer and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US9275995B2Mar 1, 2016
Semiconductor devices having composite spacers containing different dielectric materials
SAMSUNG ELECTRONICS CO LTD6 citations73
US9240461B2Jan 19, 2016
Method for fabricating semiconductor device
SAMSUNG ELECTRONICS CO LTD4 citations73
US6835996B2Dec 28, 2004
Method and device for forming an STI type isolation in a semiconductor device
SAMSUNG ELECTRONICS CO LTD5 citations73
US10008600B2Jun 26, 2018
Semiconductor device having silicon-germanium source/drain regions with varying germanium concentrations
SAMSUNG ELECTRONICS CO LTD3 citations72
US9881838B2Jan 30, 2018
Semiconductor devices having multiple gate structures and methods of manufacturing such devices
SAMSUNG ELECTRONICS CO LTD5 citations72
US9608117B2Mar 28, 2017
Semiconductor devices including a finFET
SAMSUNG ELECTRONICS CO LTD4 citations72
US9112015B2Aug 18, 2015
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD4 citations72
US10969129B2Apr 6, 2021
Apparatus and method for controlling air conditioner in air conditioning system
SAMSUNG ELECTRONICS CO LTD4 citations68
US7579249B2Aug 25, 2009
Methods for fabricating DRAM semiconductor devices including silicon epitaxial and metal silicide layers
SAMSUNG ELECTRONICS CO LTD3 citations63
US7511340B2Mar 31, 2009
Semiconductor devices having gate structures and contact pads that are lower than the gate structures
SAMSUNG ELECTRONICS CO LTD2 citations63
US7429504B2Sep 30, 2008
Heterogeneous group IV semiconductor substrates, integrated circuits formed on such substrates, and related methods
SAMSUNG ELECTRONICS CO LTD6 citations63
US7081391B2Jul 25, 2006
Integrated circuit devices having buried insulation layers and methods of forming the same
SAMSUNG ELECTRONICS CO LTD3 citations63
US6963094B2Nov 8, 2005
Metal oxide semiconductor transistors having a drain punch through blocking region and methods for fabricating metal oxide semiconductor transistors having a drain punch through blocking region
SAMSUNG ELECTRONICS CO LTD4 citations63
KIM SEOK-HOON
3 patentsUS9595611B2Mar 14, 2017
FinFET with a single contact to multiple fins bridged together to form a source/drain region of the transistor
KIM SEOK-HOON21 citations93
US9397219B2Jul 19, 2016
Semiconductor devices having source/drain regions with strain-inducing layers and methods of manufacturing such semiconductor devices
KIM SEOK-HOON8 citations83
US9368495B2Jun 14, 2016
Semiconductor devices having bridge layer and methods of manufacturing the same
KIM SEOK-HOON6 citations83
SON YONG-HOON
1 patentLEE SEUNG-HUN
1 patentPARK HEUNG-KYU
1 patentYOO JEONG-HO
1 patentKIM JIN BUM
1 patentKIM YOON HAE
1 patentAPPLIED MATERIALS INC
1 patentShowing the top 50 of 68 patents by PatentIndex Score.