P

Inventor

LEE BYEONG CHAN

US68 patents
⚠️ This page may combine multiple inventors who share the name “LEE BYEONG CHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

40 patents
US7074662B2Jul 11, 2006

Methods for fabricating fin field effect transistors using a protective layer to reduce etching damage

SAMSUNG ELECTRONICS CO LTD176 citations99
US7141856B2Nov 28, 2006

Multi-structured Si-fin

SAMSUNG ELECTRONICS CO LTD104 citations98
US6849520B2Feb 1, 2005

Method and device for forming an STI type isolation in a semiconductor device

SAMSUNG ELECTRONICS CO LTD38 citations95
US9153692B2Oct 6, 2015

Semiconductor device having a stress film on a side surface of a fin

SAMSUNG ELECTRONICS CO LTD40 citations93
US7320908B2Jan 22, 2008

Methods of forming semiconductor devices having buried oxide patterns

SAMSUNG ELECTRONICS CO LTD34 citations93
US7176067B2Feb 13, 2007

Methods of fabricating fin field effect transistors

SAMSUNG ELECTRONICS CO LTD23 citations93
US7071048B2Jul 4, 2006

Methods of fabricating fin field effect transistors having capping insulation layers

SAMSUNG ELECTRONICS CO LTD40 citations93
US9761719B2Sep 12, 2017

Semiconductor device having silicon-germanium source/drain regions with varying germanium concentrations

SAMSUNG ELECTRONICS CO LTD19 citations92
US7534686B2May 19, 2009

Multi-structured Si-fin and method of manufacture

SAMSUNG ELECTRONICS CO LTD26 citations92
US7535061B2May 19, 2009

Fin-field effect transistors (Fin-FETs) having protection layers

SAMSUNG ELECTRONICS CO LTD23 citations92
US7141456B2Nov 28, 2006

Methods of fabricating Fin-field effect transistors (Fin-FETs) having protection layers

SAMSUNG ELECTRONICS CO LTD16 citations92
US7122871B2Oct 17, 2006

Integrated circuit field effect transistors including channel-containing fin having regions of high and low doping concentrations

SAMSUNG ELECTRONICS CO LTD35 citations92
US6890823B2May 10, 2005

Methods of forming integrated circuits with thermal oxide layers on side walls of gate electrodes wherein the source and drain are higher than the gate electrode

SAMSUNG ELECTRONICS CO LTD28 citations92
US6660613B2Dec 9, 2003

Method and device for forming an STI type isolation in a semiconductor device

SAMSUNG ELECTRONICS CO LTD18 citations92
US7385237B2Jun 10, 2008

Fin field effect transistors with low resistance contact structures

SAMSUNG ELECTRONICS CO LTD24 citations91
US10388791B2Aug 20, 2019

Semiconductor device with adjacent source/drain regions connected by a semiconductor bridge, and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD8 citations84
US8039350B2Oct 18, 2011

Methods of fabricating MOS transistors having recesses with elevated source/drain regions

SAMSUNG ELECTRONICS CO LTD9 citations84
US8008698B2Aug 30, 2011

Semiconductor memory devices having vertical channel transistors and related methods

SAMSUNG ELECTRONICS CO LTD11 citations84
US7683405B2Mar 23, 2010

MOS transistors having recesses with elevated source/drain regions

SAMSUNG ELECTRONICS CO LTD12 citations84
US7642589B2Jan 5, 2010

Fin field effect transistors having capping insulation layers

SAMSUNG ELECTRONICS CO LTD9 citations84
US7521301B2Apr 21, 2009

Methods for fabricating integrated circuit field effect transistors including channel-containing fin having regions of high and low doping concentrations

SAMSUNG ELECTRONICS CO LTD10 citations84
US7394117B2Jul 1, 2008

Fin field effect transistors including epitaxial fins

SAMSUNG ELECTRONICS CO LTD9 citations84
US7268396B2Sep 11, 2007

Finfets having first and second gates of different resistivities

SAMSUNG ELECTRONICS CO LTD15 citations84
US7205609B2Apr 17, 2007

Methods of forming semiconductor devices including fin structures and related devices

SAMSUNG ELECTRONICS CO LTD10 citations84
US6900102B2May 31, 2005

Methods of forming double gate electrodes using tunnel and trench

SAMSUNG ELECTRONICS CO LTD13 citations84
US7338867B2Mar 4, 2008

Semiconductor device having contact pads and method for manufacturing the same

SAMSUNG ELECTRONICS CO LTD5 citations74
US9735158B2Aug 15, 2017

Semiconductor devices having bridge layer and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD2 citations73
US9275995B2Mar 1, 2016

Semiconductor devices having composite spacers containing different dielectric materials

SAMSUNG ELECTRONICS CO LTD6 citations73
US9240461B2Jan 19, 2016

Method for fabricating semiconductor device

SAMSUNG ELECTRONICS CO LTD4 citations73
US6835996B2Dec 28, 2004

Method and device for forming an STI type isolation in a semiconductor device

SAMSUNG ELECTRONICS CO LTD5 citations73
US10008600B2Jun 26, 2018

Semiconductor device having silicon-germanium source/drain regions with varying germanium concentrations

SAMSUNG ELECTRONICS CO LTD3 citations72
US9881838B2Jan 30, 2018

Semiconductor devices having multiple gate structures and methods of manufacturing such devices

SAMSUNG ELECTRONICS CO LTD5 citations72
US9608117B2Mar 28, 2017

Semiconductor devices including a finFET

SAMSUNG ELECTRONICS CO LTD4 citations72
US9112015B2Aug 18, 2015

Semiconductor devices

SAMSUNG ELECTRONICS CO LTD4 citations72
US10969129B2Apr 6, 2021

Apparatus and method for controlling air conditioner in air conditioning system

SAMSUNG ELECTRONICS CO LTD4 citations68
US7579249B2Aug 25, 2009

Methods for fabricating DRAM semiconductor devices including silicon epitaxial and metal silicide layers

SAMSUNG ELECTRONICS CO LTD3 citations63
US7511340B2Mar 31, 2009

Semiconductor devices having gate structures and contact pads that are lower than the gate structures

SAMSUNG ELECTRONICS CO LTD2 citations63
US7429504B2Sep 30, 2008

Heterogeneous group IV semiconductor substrates, integrated circuits formed on such substrates, and related methods

SAMSUNG ELECTRONICS CO LTD6 citations63
US7081391B2Jul 25, 2006

Integrated circuit devices having buried insulation layers and methods of forming the same

SAMSUNG ELECTRONICS CO LTD3 citations63
US6963094B2Nov 8, 2005

Metal oxide semiconductor transistors having a drain punch through blocking region and methods for fabricating metal oxide semiconductor transistors having a drain punch through blocking region

SAMSUNG ELECTRONICS CO LTD4 citations63

KIM SEOK-HOON

3 patents

SON YONG-HOON

1 patent

LEE SEUNG-HUN

1 patent

PARK HEUNG-KYU

1 patent

YOO JEONG-HO

1 patent

KIM JIN BUM

1 patent

KIM YOON HAE

1 patent

APPLIED MATERIALS INC

1 patent

Showing the top 50 of 68 patents by PatentIndex Score.