Inventor
TOLCHINSKY PETER
US8 patents
⚠️ This page may combine multiple inventors who share the name “TOLCHINSKY PETER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
7 patentsUS6908027B2Jun 21, 2005
Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process
INTEL CORP224 citations97
US7042009B2May 9, 2006
High mobility tri-gate devices and methods of fabrication
INTEL CORP80 citations96
US7569857B2Aug 4, 2009
Dual crystal orientation circuit devices on the same substrate
INTEL CORP119 citations95
US7161224B2Jan 9, 2007
Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process
INTEL CORP12 citations82
US7091108B2Aug 15, 2006
Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices
INTEL CORP9 citations71
US7531429B2May 12, 2009
Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices
INTEL CORP2 citations60
US7670928B2Mar 2, 2010
Ultra-thin oxide bonding for S1 to S1 dual orientation bonding
INTEL CORP1 citations51