Inventor
WU HUI-HSIEN
TW7 patents
⚠️ This page may combine multiple inventors who share the name “WU HUI-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
XINTEC INC
6 patentsUS9947716B2Apr 17, 2018
Chip package and manufacturing method thereof
XINTEC INC2 citations71
US11942563B1Mar 26, 2024
Manufacturing method of chip package and chip package
XINTEC INC0 citations61
US11705368B2Jul 18, 2023
Manufacturing method of chip package and chip package
XINTEC INC0 citations61
US11121031B2Sep 14, 2021
Manufacturing method of chip package and chip package
XINTEC INC0 citations61
US11137559B2Oct 5, 2021
Optical chip package and method for forming the same
XINTEC INC1 citations60
US9875912B2Jan 23, 2018
Chip package and manufacturing method thereof
XINTEC INC0 citations49