P

Inventor

TSOU HSIEN-JU

TW15 patents

Patents

15 patents
US10916450B2Feb 9, 2021

Package of integrated circuits having a light-to-heat-conversion coating material

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10269589B2Apr 23, 2019

Method of manufacturing a release film as isolation film in package

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US11855003B2Dec 26, 2023

Package structure and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11456245B2Sep 27, 2022

Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11296032B2Apr 5, 2022

Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10510732B2Dec 17, 2019

PoP device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11164855B2Nov 2, 2021

Package structure with a heat dissipating element and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations72
US12148733B2Nov 19, 2024

Shift control method in manufacture of semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11205615B2Dec 21, 2021

Semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11183482B2Nov 23, 2021

Shift control method in manufacture of semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11139285B2Oct 5, 2021

Semiconductor package

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10879194B2Dec 29, 2020

Semiconductor device package and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations59
US10586763B2Mar 10, 2020

Semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10497690B2Dec 3, 2019

Semiconductor package, method for forming semiconductor package, and method for forming semiconductor assembly

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12599031B2Apr 7, 2026

Semiconductor package and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51