Inventor
BOZORG-GRAYELI ELAH
US13 patents
Patents
13 patentsUS11935808B2Mar 19, 2024
IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects
INTEL CORP2 citations71
US12283535B2Apr 22, 2025
IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects
INTEL CORP0 citations60
US11984377B2May 14, 2024
IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects
INTEL CORP0 citations60
US11881438B2Jan 23, 2024
First-level integration of second-level thermal interface material for integrated circuit assemblies
INTEL CORP0 citations59
US11710677B2Jul 25, 2023
Ultraviolet (UV)-curable sealant in a microelectronic package
INTEL CORP0 citations56
US11935799B2Mar 19, 2024
Integrated circuit package lids with polymer features
INTEL CORP0 citations54
US11881440B2Jan 23, 2024
Carbon based polymer thermal interface materials with polymer chain to carbon based fill particle bonds
INTEL CORP0 citations54
US11710672B2Jul 25, 2023
Microelectronic package with underfilled sealant
INTEL CORP0 citations54
US11923267B2Mar 5, 2024
IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects
INTEL CORP0 citations50
US11869824B2Jan 9, 2024
Thermal interface structures for integrated circuit packages
INTEL CORP0 citations44
US11004768B2May 11, 2021
Multi-chip package with partial integrated heat spreader
INTEL CORP0 citations43
US10475715B2Nov 12, 2019
Two material high K thermal encapsulant system
INTEL CORP0 citations36
US10569298B2Feb 25, 2020
Substrate with epoxy cured by ultraviolet laser
INTEL CORP0 citations30