P

Inventor

YEH CHANG-LIN

TW37 patents
⚠️ This page may combine multiple inventors who share the name “YEH CHANG-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED SEMICONDUCTOR ENG

36 patents
US10629454B2Apr 21, 2020

Semiconductor package device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG7 citations84
US10580713B2Mar 3, 2020

Semiconductor package device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG6 citations84
US10096578B1Oct 9, 2018

Semiconductor package device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG8 citations84
US7329900B2Feb 12, 2008

Bonding strength testing device

ADVANCED SEMICONDUCTOR ENG12 citations83
US11626360B2Apr 11, 2023

Semiconductor device package and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG2 citations73
US11410899B2Aug 9, 2022

Semiconductor package device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG3 citations73
US11133244B2Sep 28, 2021

Semiconductor device package and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG3 citations73
US11224132B2Jan 11, 2022

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG2 citations72
US10381300B2Aug 13, 2019

Semiconductor device package including filling mold via

ADVANCED SEMICONDUCTOR ENG4 citations71
US11462455B2Oct 4, 2022

Semiconductor package device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG4 citations67
US12364008B2Jul 15, 2025

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG1 citations63
US12334412B2Jun 17, 2025

Electronic package and method of forming the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US12186094B2Jan 7, 2025

Wearable device

ADVANCED SEMICONDUCTOR ENG0 citations62
US12176276B2Dec 24, 2024

Semiconductor device package and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US12087652B2Sep 10, 2024

Semiconductor package device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US12089349B2Sep 10, 2024

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11997888B2May 28, 2024

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG1 citations62
US11948852B2Apr 2, 2024

Semiconductor device package

ADVANCED SEMICONDUCTOR ENG0 citations62
US11862544B2Jan 2, 2024

Electronic assembly

ADVANCED SEMICONDUCTOR ENG0 citations62
US11744024B2Aug 29, 2023

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11710689B2Jul 25, 2023

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11575995B2Feb 7, 2023

Semiconductor package device and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11437415B2Sep 6, 2022

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11222792B2Jan 11, 2022

Semiconductor package device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11211302B2Dec 28, 2021

Semiconductor device package

ADVANCED SEMICONDUCTOR ENG0 citations62
US11201200B2Dec 14, 2021

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11081473B2Aug 3, 2021

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US10991656B2Apr 27, 2021

Semiconductor device package

ADVANCED SEMICONDUCTOR ENG0 citations62
US10411766B2Sep 10, 2019

Semiconductor package device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG1 citations62
US11942385B2Mar 26, 2024

Semiconductor package structure

ADVANCED SEMICONDUCTOR ENG0 citations61
US11289394B2Mar 29, 2022

Semiconductor package structure

ADVANCED SEMICONDUCTOR ENG0 citations61
US10861779B2Dec 8, 2020

Semiconductor device package having an electrical contact with a high-melting-point part and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations52
US10332849B2Jun 25, 2019

Semiconductor package device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations48
US10074622B2Sep 11, 2018

Semiconductor package device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations48
US10483254B2Nov 19, 2019

Electronic module and semiconductor package device

ADVANCED SEMICONDUCTOR ENG0 citations41
US10438889B2Oct 8, 2019

Semiconductor package device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations41

CHANG HSIAO-CHUAN

1 patent