Inventor
GANSAUGE PETER
DE3 patents
Patents
3 patentsUS5244833ASep 14, 1993
Method for manufacturing an integrated circuit chip bump electrode using a polymer layer and a photoresist layer
IBM155 citations96
US5010389AApr 23, 1991
Integrated circuit substrate with contacts thereon for a packaging structure
IBM55 citations93
US3960605AJun 1, 1976
Method of implantation of boron ions utilizing a boron oxide ion source
IBM32 citations79