Inventor
KREUTER VOLKER
DE3 patents
Patents
3 patentsUS5244833ASep 14, 1993
Method for manufacturing an integrated circuit chip bump electrode using a polymer layer and a photoresist layer
IBM155 citations96
US5010389AApr 23, 1991
Integrated circuit substrate with contacts thereon for a packaging structure
IBM55 citations93
US5744996AApr 28, 1998
CMOS integrated semiconductor circuit
IBM48 citations89