Inventor
OTHIENO MAURICE O
US11 patents
⚠️ This page may combine multiple inventors who share the name “OTHIENO MAURICE O”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
5 patentsUS6867480B2Mar 15, 2005
Electromagnetic interference package protection
LSI LOGIC CORP29 citations91
US6654248B1Nov 25, 2003
Top gated heat dissipation
LSI LOGIC CORP39 citations89
US6603201B1Aug 5, 2003
Electronic substrate
LSI LOGIC CORP6 citations61
US7327043B2Feb 5, 2008
Two layer substrate ball grid array design
LSI LOGIC CORP2 citations56
US6801437B2Oct 5, 2004
Electronic organic substrate
LSI LOGIC CORP0 citations40
LSI CORP
4 patentsUS7420809B2Sep 2, 2008
Heat spreader in integrated circuit package
LSI CORP33 citations91
US7436060B2Oct 14, 2008
Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly
LSI CORP2 citations61
US7235889B2Jun 26, 2007
Integrated heatspreader for use in wire bonded ball grid array semiconductor packages
LSI CORP6 citations61
US7646091B2Jan 12, 2010
Semiconductor package and method using isolated Vss plane to accommodate high speed circuitry ground isolation
LSI CORP3 citations59