Inventor

KIM DO HYUNG

KR371 patents

⚠️ This page may combine multiple inventors who share the name “KIM DO HYUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM DO HYUNG

AMKOR TECHNOLOGY INC

Reduced profile stackable semiconductor package

Semiconductor package using a coreless signal distribution structure

Semiconductor package and its manufacturing method

Semiconductor device with thin redistribution layers

Manufacturing method of semiconductor device and semiconductor device thereof

Stacked semiconductor package and method of making same

Semiconductor package using a coreless signal distribution structure

Manufacturing method of semiconductor device and semiconductor device thereof

Semiconductor device with thin redistribution layers

Manufacturing method of semiconductor device and semiconductor device thereof

Manufacturing method of semiconductor device and semiconductor device thereof

Semiconductor device with thin redistribution layers

SAMSUNG ELECTRONICS CO LTD

Semiconductor device having LDD-type source/drain regions and fabrication method thereof

Semiconductor device having a trench isolation structure and method for fabricating the same

Method, medium, and system visually compressing image data

Stacked board-on-chip package having mirroring structure and dual inline memory module on which the stacked board-on-chip packages are mounted

Semiconductor device having shared contact and fabrication method thereof

Method of forming a device isolation trench in an integrated circuit device

Method of forming a silicon nitride layer in a semiconductor device

Digital audio encoding method utilizing look-up table and device thereof

Reconfigurable processor and method of operating the same

Method, medium, and system compressing and/or reconstructing image information with low complexity

SEOUL SEMICONDUCTOR CO LTD

Light emitting device having various color temperature

Leadframe and packaged light emitting diode

Side illumination lens and luminescent device using the same

LED package

Light emitting diode package having multiple molding resins on a light emitting diode die

Light emitting diode package with a heat sink support ring and having multiple molding resins, wherein secondary molding resin with higher hardness than primary molding resin and which covers primary molding resin that covers LED die

LED package with metal PCB

Light emitting diode (LED)

Multi-light emitting diode package

KOREA ELECTRONICS TELECOMM

Apparatus and method for high-speed marker-free motion capture

Method and apparatus for recognizing gesture in image processing system

Independent checkpointing method using a memory checkpoint on a distributed system

User recognition system and method thereof

Cathode structure for field emission device and method of fabricating the same

Human-tracking method and robot apparatus for performing the same

KIM DO HYUNG

Light emitting diode (LED)

LED package having a lead frame

SK HYNIX INC

Semiconductor device including air gaps and method for fabricating the same

LG SEMICON CO LTD

Device for managing snap shot in USB camera and method therefor

LG DISPLAY CO LTD

Organic light emitting diode display device having a dam for controlling flow of encapsulant

LEE SANG-JO

Encoding and/or decoding system, medium, and method with spatial prediction and spatial prediction compensation of image data

YOON HO SUB

Apparatus and method for recognizing identifier of vehicle

WHITEHEAD BIOMEDICAL INST

mTOR kinase-associated proteins

JUNG JUNG HWA

Light emitting diode package

PARK JIN-SOO

Doherty amplifier and transmitter using mixer

BAE JEONG SUK

Ultraviolet light emitting diode package

MIN KYUNG-HEE

Dual panel type organic electroluminescent display device and method of fabricating the same

SAMSUNG DISPLAY CO LTD

Organic light emitting diode display device