Inventor

SEO HYUN CHUL

KR19 patents

⚠️ This page may combine multiple inventors who share the name “SEO HYUN CHUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEO HYUN CHUL

SK HYNIX INC

Semiconductor chip module and semiconductor package including the same

Semiconductor chip including through electrode, and semiconductor package including the same

Semiconductor package

Semiconductor package and package substrate including vent hole

Semiconductor chip including through electrode, and semiconductor package including the same

Semiconductor devices including recognition marks

Semiconductor packages including different type semiconductor chips having exposed top surfaces and methods of manufacturing the semiconductor packages

Semiconductor wafer, method for separating the semiconductor wafer, semiconductor chip, and semiconductor package including the semiconductor chip

Methods of fabricating semiconductor packages including circuit patterns

Semiconductor package including a semiconductor chip having a redistribution layer

Semiconductor device including redistribution layer and method for fabricating the same

Semiconductor package including stacked semiconductor chips

Semiconductor chip module and semiconductor package including the same

Semiconductor package including stacked semiconductor chips

Semiconductor device with decreased overlapping area between redistribution lines and signal lines

SAMSUNG ELECTRONICS CO LTD

Data structure for implementation of traffic engineering function in multiprotocol label switching system and storage medium for storing the same

ROH HEE RA

Semiconductor chip and semiconductor package having the same

VICLIP INC

Method for distributing certificate of right to use digital content, and computer program stored in medium in order to carry out method

SEO HYUN CHUL

Semiconductor device including inner interconnection structure able to conduct signals or voltages in the semiconductor chip with vertical connection vias and horizontal buried conductive lines