Inventor

CAI ZHONGPING

US6 patents

⚠️ This page may combine multiple inventors who share the name “CAI ZHONGPING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KLA TENCOR CORP

2 patents

US9097645B2Aug 4, 2015

Method and system for high speed height control of a substrate surface within a wafer inspection system

KLA TENCOR CORP4 citations64

US9810619B2Nov 7, 2017

Method and system for simultaneous tilt and height control of a substrate surface in an inspection system

KLA TENCOR CORP0 citations35

PETRENKO ALEKSEY

1 patent

US9068952B2Jun 30, 2015

Method and apparatus for producing and measuring dynamically focussed, steered, and shaped oblique laser illumination for spinning wafer inspection system

PETRENKO ALEKSEY4 citations65

CAI ZHONGPING

1 patent

US9091666B2Jul 28, 2015

Extended defect sizing range for wafer inspection

CAI ZHONGPING2 citations54

KLA TENCOR TECH CORP

1 patent

US7746462B2Jun 29, 2010

Inspection systems and methods for extending the detection range of an inspection system by forcing the photodetector into the non-linear range

KLA TENCOR TECH CORP0 citations49

VELODYNE LIDAR USA INC

1 patent

US12105225B2Oct 1, 2024

Systems and methods for calibrating a LiDAR device

VELODYNE LIDAR USA INC0 citations43