Inventor
HSU JIA-CHENG
US2 patents
Patents
2 patentsUS9409276B2Aug 9, 2016
CMP polishing pad having edge exclusion region of offset concentric groove pattern
CABOT MICROELECTRONICS CORP11 citations77
US9687956B2Jun 27, 2017
Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith
CABOT MICROELECTRONICS CORP9 citations76