Inventor
HAKATA TOMOYUKI
JP5 patents
Patents
5 patentsUS10632517B2Apr 28, 2020
Crimp structure, crimping method, and electronic device
OMRON TATEISI ELECTRONICS CO2 citations70
US9793637B2Oct 17, 2017
Crimp structure, crimping method, and electronic device
OMRON TATEISI ELECTRONICS CO2 citations70
US10449698B2Oct 22, 2019
Bonded structure and method for producing bonded structure
OMRON TATEISI ELECTRONICS CO2 citations66
US12446193B2Oct 14, 2025
Heat-dissipating structure
OMRON TATEISI ELECTRONICS CO0 citations42
US10471660B2Nov 12, 2019
Manufacturing method of bonding structure and bonding structure
OMRON TATEISI ELECTRONICS CO0 citations37