Inventor
GABLER FRANZ
DE4 patents
Patents
4 patentsUS10519030B2Dec 31, 2019
Transducer package with integrated sealing
INFINEON TECHNOLOGIES AG2 citations72
US9780061B2Oct 3, 2017
Molded chip package and method of manufacturing the same
INFINEON TECHNOLOGIES AG2 citations70
US9548248B2Jan 17, 2017
Method of processing a substrate and a method of processing a wafer
INFINEON TECHNOLOGIES AG4 citations69
US9324642B2Apr 26, 2016
Method of electrically isolating shared leads of a lead frame strip
INFINEON TECHNOLOGIES AG2 citations53