Inventor

DENG YIKANG

US43 patents

⚠️ This page may combine multiple inventors who share the name “DENG YIKANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DENG YIKANG

INTEL CORP

Microelectronic assemblies having a cooling channel

Phase change material in substrate cavity

Helical plated through-hole package inductor

Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate

Stacked die cavity package

Method of making an inductor

Electronic device including a lateral trace

Metal protected fan-out cavity

Coreless package architecture for multi-chip opto-electronics

Microelectronic assemblies having conductive structures with different thicknesses on a core substrate

Package-integrated multi-turn coil embedded in a package magnetic core

Magnetic structures in integrated circuit package supports

Stacked die cavity package

Magnetic core inductors

Helical plated through-hole package inductor

Multi-layer embedded magnetic inductor coil

Package-integrated multi-turn coil embedded in a package magnetic core

Microelectronic assemblies having conductive structures with different thicknesses on a core substrate

Techniques for an inductor at a first level interface

Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate

Techniques for an inductor at a second level interface

Semiconductor package substrate with through-hole magnetic core inductor using conductive paste

Techniques for an inductor at a second level interface

Substrate assembly with magnetic feature

Magnetic bilayer structure for a cored or coreless semiconductor package

Magnetic structures in integrated circuit packages

Dual trace thickness for single layer routing

Apparatus with embedded fine line space in a cavity, and a method for forming the same

Microelectronic substrate having embedded trace layers with integral attachment structures

Methods of defect inspection of plated through hole structures utilizing fluorescent conductive fill material

Integrated circuit package structures

Microelectronic substrate having embedded trace layers with integral attachment structures

Thermal management solutions for integrated circuit packages

In-plane inductors in IC packages

Microelectronic structures including bridges

Effective heat conduction from hotspot to heat spreader through package substrate

Systems and methods for semiconductor packages using photoimageable layers

SHENZHEN XINGRISHENG IND CO

Litter box

Pet excrement collecting device capable of closing excrement collecting bag

APPLE INC

Asymmetric stackup structure for SoC package substrates

Asymmetric Stackup Structure for SoC package substrates

TAHOE RES LTD

Electronic device including a lateral trace

IM JAMES S

Systems and methods for non-periodic pulse partial melt film processing