Inventor
CHENG LIWEI
US9 patents
⚠️ This page may combine multiple inventors who share the name “CHENG LIWEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
6 patentsUS10741947B2Aug 11, 2020
Plated through hole socketing coupled to a solder ball to engage with a pin
INTEL CORP2 citations71
US12288744B2Apr 29, 2025
Microelectronic assemblies having conductive structures with different thicknesses on a core substrate
INTEL CORP0 citations62
US11380609B2Jul 5, 2022
Microelectronic assemblies having conductive structures with different thicknesses on a core substrate
INTEL CORP0 citations62
US11769719B2Sep 26, 2023
Dual trace thickness for single layer routing
INTEL CORP0 citations59
US11705389B2Jul 18, 2023
Vias for package substrates
INTEL CORP0 citations57
US11393762B2Jul 19, 2022
Formation of tall metal pillars using multiple photoresist layers
INTEL CORP0 citations50