Inventor
KU JONG HOE
KR3 patents
Patents
3 patentsUS11227775B2Jan 18, 2022
Method of fabricating carrier for wafer level package by using lead frame
HAESUNG DS CO LTD0 citations54
US12327728B2Jun 10, 2025
Method for manufacturing a pre-mold substrate
HAESUNG DS CO LTD0 citations41
US12249571B2Mar 11, 2025
Pre-mold substrate and method of manufacturing pre-mold substrate
HAESUNG DS CO LTD0 citations41