Inventor
BAE IN SEOB
KR14 patents
Patents
14 patentsUS9460986B2Oct 4, 2016
Method of manufacturing semiconductor package substrate with limited use of film resist and semiconductor package substrate manufactured using the same
HAESUNG DS CO LTD3 citations66
US10910299B2Feb 2, 2021
Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the method, and method of manufacturing semiconductor package and semiconductor package manufactured using the method
HAESUNG DS CO LTD1 citations61
US9171789B2Oct 27, 2015
Lead frame, semiconductor package including the lead frame, and method of manufacturing the lead frame
HAESUNG DS CO LTD3 citations60
US11876012B2Jan 16, 2024
Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same
HAESUNG DS CO LTD0 citations57
US12341086B2Jun 24, 2025
Lead frame
HAESUNG DS CO LTD0 citations54
US11227775B2Jan 18, 2022
Method of fabricating carrier for wafer level package by using lead frame
HAESUNG DS CO LTD0 citations54
US11854830B2Dec 26, 2023
Method of manufacturing circuit board
HAESUNG DS CO LTD0 citations50
US10840170B2Nov 17, 2020
Semiconductor package substrate and method for manufacturing same
HAESUNG DS CO LTD0 citations50
US10643932B2May 5, 2020
Semiconductor package substrate and method for manufacturing same
HAESUNG DS CO LTD0 citations50
US10643933B2May 5, 2020
Semiconductor package substrate and manufacturing method therefor
HAESUNG DS CO LTD0 citations50
US12327728B2Jun 10, 2025
Method for manufacturing a pre-mold substrate
HAESUNG DS CO LTD0 citations41
US12249571B2Mar 11, 2025
Pre-mold substrate and method of manufacturing pre-mold substrate
HAESUNG DS CO LTD0 citations41
US10840161B2Nov 17, 2020
Method for manufacturing semiconductor package substrate
HAESUNG DS CO LTD0 citations41
US10811302B2Oct 20, 2020
Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same
HAESUNG DS CO LTD0 citations41