Inventor
DIPIETRO MICHAEL
US6 patents
⚠️ This page may combine multiple inventors who share the name “DIPIETRO MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
4 patentsUS5519936AMay 28, 1996
Method of making an electronic package with a thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
IBM113 citations96
US5633533AMay 27, 1997
Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
IBM58 citations94
US5561323AOct 1, 1996
Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
IBM67 citations94
US5773884AJun 30, 1998
Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
IBM67 citations92