Inventor

ICHIZOE HIROYUKI

JP7 patents

⚠️ This page may combine multiple inventors who share the name “ICHIZOE HIROYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RENESAS TECH CORP

2 patents

US7208391B2Apr 24, 2007

Method of manufacturing a semiconductor integrated circuit device that includes forming an isolation trench around active regions and filling the trench with two insulating films

RENESAS TECH CORP19 citations92

US6693008B1Feb 17, 2004

Method of manufacturing a semiconductor integrated circuit device and a semiconductor integrated circuit device

RENESAS TECH CORP29 citations92

HITACHI LTD

2 patents

US6720234B2Apr 13, 2004

Semiconductor integrated circuit device and method of manufacturing involving the scale-down width of shallow groove isolation using round processing

HITACHI LTD5 citations73

US6562695B1May 13, 2003

Semiconductor integrated circuit device and method of manufacturing involving the scale-down width of shallow groove isolation using round processing

HITACHI LTD12 citations73

HITACHI ULSI SYSTEMS C O LTD

1 patent

US7074691B2Jul 11, 2006

Method of manufacturing a semiconductor integrated circuit device that includes forming dummy patterns in an isolation region prior to filling with insulating material

HITACHI ULSI SYSTEMS C O LTD20 citations89

HITACHI ULSI SYS CO LTD

1 patent

US7060589B2Jun 13, 2006

Method for manufacturing a semiconductor integrated circuit device that includes covering the bottom of an isolation trench with spin-on glass and etching back the spin-on glass to a predetermined depth

HITACHI ULSI SYS CO LTD4 citations73

ELPIDA MEMORY INC

1 patent

US7397104B2Jul 8, 2008

Semiconductor integrated circuit device and a method of manufacturing the same

ELPIDA MEMORY INC0 citations52