Inventor

EMIGH ROGER

US4 patents

⚠️ This page may combine multiple inventors who share the name “EMIGH ROGER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

2 patents

US7064430B2Jun 20, 2006

Stacked die packaging and fabrication method

STATS CHIPPAC LTD16 citations83

US7968377B2Jun 28, 2011

Integrated circuit protruding pad package system

STATS CHIPPAC LTD1 citations51

ST ASSEMBLY TEST SERVICES LTD

1 patent

US6775140B2Aug 10, 2004

Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices

ST ASSEMBLY TEST SERVICES LTD79 citations96

CHOW SENG GUAN

1 patent

US8587098B2Nov 19, 2013

Integrated circuit protruding pad package system and method for manufacturing thereof

CHOW SENG GUAN0 citations51