Inventor

AHL BENGT

SE9 patents

⚠️ This page may combine multiple inventors who share the name “AHL BENGT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ERICSSON INC

3 patents

US6181006B1Jan 30, 2001

Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink

ERICSSON INC20 citations91

US6160710ADec 12, 2000

Capacitive mounting arrangement for securing an integrated circuit package to a heat sink

ERICSSON INC30 citations91

US6392298B1May 21, 2002

Functional lid for RF power package

ERICSSON INC24 citations88

INFINEON TECHNOLOGIES AG

2 patents

US6583673B2Jun 24, 2003

Stability enhanced multistage power amplifier

INFINEON TECHNOLOGIES AG15 citations83

US6777791B2Aug 17, 2004

Multiple ground signal path LDMOS power package

INFINEON TECHNOLOGIES AG14 citations80

ERICSSON TELEFON AB L M

2 patents

US6580316B2Jun 17, 2003

Power transistor module, power amplifier and methods in the fabrication thereof

ERICSSON TELEFON AB L M8 citations72

US6501159B2Dec 31, 2002

Power transistor module, power amplifier and method in the fabrication thereof

ERICSSON TELEFON AB L M1 citations51

ERICSSON GE MOBILE INC

1 patent

US5933327AAug 3, 1999

Wire bond attachment of a integrated circuit package to a heat sink

ERICSSON GE MOBILE INC220 citations97

ERICCSON INC

1 patent

US5869897AFeb 9, 1999

Mounting arrangement for securing an intergrated circuit package to heat sink

ERICCSON INC12 citations72