Inventor
KO JENG-DAR
TW8 patents
⚠️ This page may combine multiple inventors who share the name “KO JENG-DAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
4 patentsUS7294920B2Nov 13, 2007
Wafer-leveled chip packaging structure and method thereof
IND TECH RES INST92 citations98
US7528009B2May 5, 2009
Wafer-leveled chip packaging structure and method thereof
IND TECH RES INST20 citations92
US7632707B2Dec 15, 2009
Electronic device package and method of manufacturing the same
IND TECH RES INST3 citations62
US7838333B2Nov 23, 2010
Electronic device package and method of manufacturing the same
IND TECH RES INST0 citations51