Inventor
LIN JYH-RONG
TW18 patents
⚠️ This page may combine multiple inventors who share the name “LIN JYH-RONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
8 patentsUS7294920B2Nov 13, 2007
Wafer-leveled chip packaging structure and method thereof
IND TECH RES INST92 citations98
US6277669B1Aug 21, 2001
Wafer level packaging method and packages formed
IND TECH RES INST274 citations98
US7528009B2May 5, 2009
Wafer-leveled chip packaging structure and method thereof
IND TECH RES INST20 citations92
US7411306B2Aug 12, 2008
Packaging structure and method of an image sensor module
IND TECH RES INST17 citations90
US6358836B1Mar 19, 2002
Wafer level package incorporating elastomeric pads in dummy plugs
IND TECH RES INST42 citations89
US7572676B2Aug 11, 2009
Packaging structure and method of an image sensor module
IND TECH RES INST10 citations82
US7632707B2Dec 15, 2009
Electronic device package and method of manufacturing the same
IND TECH RES INST3 citations62
US7838333B2Nov 23, 2010
Electronic device package and method of manufacturing the same
IND TECH RES INST0 citations51