Inventor

WANG PO-HAN

TW54 patents

⚠️ This page may combine multiple inventors who share the name “WANG PO-HAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG PO-HAN

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor package and method

Planarizing RDLs in RDL-first processes through CMP process

Info structure and method forming same

Stacked via structure

Redistribution structure for semiconductor device and method of forming same

Semiconductor package and method

Lithography

Semiconductor package and method

Semiconductor package

Planarizing RDLS in RDL-first processes through CMP process

Package structure and method of manufacturing the same

Semiconductor package comprising molding compound having extended portion and manufacturing method of semiconductor package

Method of fabricating redistribution circuit structure

Semiconductor package comprising molding compound having extended portion and manufacturing method of semiconductor package

Info structure and method forming same

Package structure and method of manufacturing the same

Package structure and method of fabricating the same

Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films

Semiconductor package

Apparatus, system and method

Redistribution structure for semiconductor device and method of forming same

Apparatus, system and method

Method of fabricating redistribution circuit structure

Semiconductor package with alignment mark and manufacturing method thereof

Method of fabricating redistribution circuit structure

Info structure and method forming same

Stacked via structure

Semiconductor structure, semiconductor package and method of fabricating the same

Semiconductor package and manufacturing method thereof

Info structure and method forming same

Method of fabricating integrated fan-out packages

Semiconductor package and method of forming the same

Semiconductor device, semiconductor package and manufacturing method thereof

Integrated circuit package and method

Lithography

Integrated circuit package and method

Sensor package and method

Integrated circuit package and method

Semiconductor package and method for manufacturing the same

Semiconductor devices having conductive pad structures with multi-barrier films

Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films

Semiconductor package and method for manufacturing the same

Method of manufacturing package structure

Package structure, semiconductor device and method of fabricating the same

Method of manufacturing package structure

Planarizing RDLS in RDL—First Processes Through CMP Process

Package structure and method of fabricating the same

UNIV CALIFORNIA

BLE and/or WiFi compliant and blocker-resilient wake-up receiver and method

Low power wake-up receiver

Low power Wi-Fi backscatter communication