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Inventor
LEE BYOUNG DO
KR
5 patents
⚠️ This page may combine multiple inventors who share the name “LEE BYOUNG DO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KANG TAE MIN
3 patents
US8680688B2
Mar 25, 2014
Stack package having flexible conductors
KANG TAE MIN
5 citations
70
US8288873B2
Oct 16, 2012
Stack package having flexible conductors
KANG TAE MIN
5 citations
70
US8164200B2
Apr 24, 2012
Stack semiconductor package and method for manufacturing the same
KANG TAE MIN
0 citations
37
SK HYNIX INC
1 patent
US9390997B2
Jul 12, 2016
Semiconductor chip and stacked type semiconductor package having the same
SK HYNIX INC
6 citations
69
LEE DAE WOONG
1 patent
US8810309B2
Aug 19, 2014
Stack package and method for selecting chip in stack package
LEE DAE WOONG
3 citations
57