Inventor

MAHADEVAN MOHAN

GB33 patents

⚠️ This page may combine multiple inventors who share the name “MAHADEVAN MOHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MAHADEVAN MOHAN

KLA TENCOR CORP

Accelerating semiconductor-related computations using learning based models

Contour based defect detection

Learning based approach for aligning images acquired with different modalities

Accelerated training of a machine learning based model for semiconductor applications

Apparatus and methods for combined brightfield, darkfield, and photothermal inspection

Unified neural network for defect detection and classification

Systems and methods for detecting defects on a wafer

Automated inline inspection and metrology using shadow-gram images

In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning

Apparatus and methods for combined brightfield, darkfield, and photothermal inspection

Systems and methods for detecting defects on a wafer

Automated inline inspection of wafer edge strain profiles using rapid photoreflectance spectroscopy

Semiconductor inspection and metrology systems for distributing job among the CPUs or GPUs based on logical image processing boundaries

Wafer and lot based hierarchical method combining customized metrics with a global classification methodology to monitor process tool condition at extremely high throughput

Generating high resolution images from low resolution images for semiconductor applications

Automated image-based process monitoring and control

ONFIDO LTD

Scalable, flexible and robust template-based data extraction pipeline

Methods and systems for authentication of a physical document

Generalized anomaly detection

Methods and systems for authentication of a physical document

Signal-based machine learning fraud detection

Methods and systems for fraud detection using relative movement of facial features

Method for detecting fraud in documents

Methods and systems for detecting fraud during biometric identity verification

AMAZON TECH INC

Right-sized thermoformed cavities for packaging items

Packaging items using customized 3D-printed dunnage

Inflatable packaging materials, automated packaging systems, and related methods

Right-sized thermoformed cavities for packaging items

CHEN LU

Systems and methods for detecting defects on a wafer

Systems and methods for detecting defects on a wafer

BHASKAR KRIS

Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions

MAHADEVAN MOHAN

Automated inspection scenario generation

THATTAISUNDARAM GOVIND

Data perturbation for wafer inspection or metrology setup using a model of a difference