Inventor
HONG CHII SHANG
MY15 patents
⚠️ This page may combine multiple inventors who share the name “HONG CHII SHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
11 patentsUS11876028B2Jan 16, 2024
Package with electrically insulated carrier and at least one step on encapsulant
INFINEON TECHNOLOGIES AG2 citations71
US11075185B2Jul 27, 2021
Semiconductor package with multi-level conductive clip for top side cooling
INFINEON TECHNOLOGIES AG4 citations70
US12094793B2Sep 17, 2024
Package with electrically insulated carrier and at least one step on encapsulant
INFINEON TECHNOLOGIES AG0 citations61
US11942383B2Mar 26, 2024
Linear spacer for spacing a carrier of a package
INFINEON TECHNOLOGIES AG0 citations61
US10971436B2Apr 6, 2021
Multi-branch terminal for integrated circuit (IC) package
INFINEON TECHNOLOGIES AG0 citations59
US12334414B2Jun 17, 2025
Power semiconductor device with dual heat dissipation structures
INFINEON TECHNOLOGIES AG0 citations56
US11908771B2Feb 20, 2024
Power semiconductor device with dual heat dissipation structures
INFINEON TECHNOLOGIES AG1 citations56
US10354943B1Jul 16, 2019
Multi-branch terminal for integrated circuit (IC) package
INFINEON TECHNOLOGIES AG0 citations48
US10978380B2Apr 13, 2021
Semiconductor package with multi-level conductive clip for top side cooling
INFINEON TECHNOLOGIES AG0 citations47
US12512380B2Dec 30, 2025
Semiconductor packages including a package body with grooves formed therein
INFINEON TECHNOLOGIES AG0 citations44
US10840164B2Nov 17, 2020
Wire bonded package with single piece exposed heat slug and leads
INFINEON TECHNOLOGIES AG0 citations38
INFINEON TECHNOLOGIES AUSTRIA AG
4 patentsUS12080625B2Sep 3, 2024
Semiconductor package with releasable isolation layer protection
INFINEON TECHNOLOGIES AUSTRIA AG0 citations53
US11791238B2Oct 17, 2023
Semiconductor package with releasable isolation layer protection
INFINEON TECHNOLOGIES AUSTRIA AG0 citations53
US11289436B2Mar 29, 2022
Semiconductor package having a laser-activatable mold compound
INFINEON TECHNOLOGIES AUSTRIA AG0 citations50
US11804424B2Oct 31, 2023
Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip
INFINEON TECHNOLOGIES AUSTRIA AG0 citations47