Inventor
SCHMOELZER BERND
AT16 patents
⚠️ This page may combine multiple inventors who share the name “SCHMOELZER BERND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AUSTRIA AG
12 patentsUS11728250B2Aug 15, 2023
Semiconductor package with connection lug
INFINEON TECHNOLOGIES AUSTRIA AG2 citations71
US11211304B2Dec 28, 2021
Assembly and method for mounting an electronic component to a substrate
INFINEON TECHNOLOGIES AUSTRIA AG2 citations70
US10373897B2Aug 6, 2019
Semiconductor devices with improved thermal and electrical performance
INFINEON TECHNOLOGIES AUSTRIA AG4 citations69
US12080669B2Sep 3, 2024
Semiconductor device module having vertical metallic contacts and a method for fabricating the same
INFINEON TECHNOLOGIES AUSTRIA AG0 citations62
US10755999B2Aug 25, 2020
Multi-package top-side-cooling
INFINEON TECHNOLOGIES AUSTRIA AG1 citations62
US12463116B2Nov 4, 2025
Method for fabricating a semiconductor device including an embedded semiconductor die
INFINEON TECHNOLOGIES AUSTRIA AG0 citations59
US12438068B2Oct 7, 2025
Stacked module arrangement
INFINEON TECHNOLOGIES AUSTRIA AG0 citations59
US12002739B2Jun 4, 2024
Semiconductor device including an embedded semiconductor die
INFINEON TECHNOLOGIES AUSTRIA AG0 citations59
US12506051B2Dec 23, 2025
Semiconductor package comprising a cavity with exposed contacts and a semiconductor module
INFINEON TECHNOLOGIES AUSTRIA AG0 citations55
US12125772B2Oct 22, 2024
Method of forming a semiconductor package with connection lug
INFINEON TECHNOLOGIES AUSTRIA AG0 citations50
US9972576B2May 15, 2018
Semiconductor chip package comprising side wall marking
INFINEON TECHNOLOGIES AUSTRIA AG1 citations49
US10699978B2Jun 30, 2020
SMD package with top side cooling
INFINEON TECHNOLOGIES AUSTRIA AG0 citations40
INFINEON TECHNOLOGIES AG
4 patentsUS11876028B2Jan 16, 2024
Package with electrically insulated carrier and at least one step on encapsulant
INFINEON TECHNOLOGIES AG2 citations71
US12094793B2Sep 17, 2024
Package with electrically insulated carrier and at least one step on encapsulant
INFINEON TECHNOLOGIES AG0 citations61
US11942383B2Mar 26, 2024
Linear spacer for spacing a carrier of a package
INFINEON TECHNOLOGIES AG0 citations61
US12512380B2Dec 30, 2025
Semiconductor packages including a package body with grooves formed therein
INFINEON TECHNOLOGIES AG0 citations44