Inventor
WANG LEE SHUANG
MY13 patents
⚠️ This page may combine multiple inventors who share the name “WANG LEE SHUANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
9 patentsUS11876028B2Jan 16, 2024
Package with electrically insulated carrier and at least one step on encapsulant
INFINEON TECHNOLOGIES AG2 citations71
US10147703B2Dec 4, 2018
Semiconductor package for multiphase circuitry device
INFINEON TECHNOLOGIES AG3 citations68
US12094793B2Sep 17, 2024
Package with electrically insulated carrier and at least one step on encapsulant
INFINEON TECHNOLOGIES AG0 citations61
US11676881B2Jun 13, 2023
Semiconductor package, semiconductor assembly and method for fabricating a semiconductor package
INFINEON TECHNOLOGIES AG1 citations61
US11011456B2May 18, 2021
Lead frames including lead posts in different planes
INFINEON TECHNOLOGIES AG0 citations57
US11362023B2Jun 14, 2022
Package lead design with grooves for improved dambar separation
INFINEON TECHNOLOGIES AG0 citations50
US11355424B2Jun 7, 2022
Multi-chip package
INFINEON TECHNOLOGIES AG0 citations49
US12512380B2Dec 30, 2025
Semiconductor packages including a package body with grooves formed therein
INFINEON TECHNOLOGIES AG0 citations44
US10840164B2Nov 17, 2020
Wire bonded package with single piece exposed heat slug and leads
INFINEON TECHNOLOGIES AG0 citations38
INFINEON TECHNOLOGIES AUSTRIA AG
4 patentsUS9922910B2Mar 20, 2018
Functionalized interface structure
INFINEON TECHNOLOGIES AUSTRIA AG7 citations82
US10204845B2Feb 12, 2019
Semiconductor chip package having a repeating footprint pattern
INFINEON TECHNOLOGIES AUSTRIA AG2 citations72
US11348866B2May 31, 2022
Package and lead frame design for enhanced creepage and clearance
INFINEON TECHNOLOGIES AUSTRIA AG0 citations50
US11804424B2Oct 31, 2023
Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip
INFINEON TECHNOLOGIES AUSTRIA AG0 citations47