Inventor
LIM WEE AUN JASON
MY3 patents
Patents
3 patentsUS11211356B2Dec 28, 2021
Power semiconductor package and method for fabricating a power semiconductor package
INFINEON TECHNOLOGIES AG0 citations53
US11239127B2Feb 1, 2022
Topside-cooled semiconductor package with molded standoff
INFINEON TECHNOLOGIES AG0 citations44
US12538810B2Jan 27, 2026
Molded package having an electrically conductive clip with a convex curved surface attached to a semiconductor die
INFINEON TECHNOLOGIES AG0 citations34