Inventor

HIROI MASAYUKI

JP27 patents

⚠️ This page may combine multiple inventors who share the name “HIROI MASAYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HIROI MASAYUKI

NEC ELECTRONICS CORP

Chemically amplified resist composition, process for manufacturing semiconductor device and patterning process

Semiconductor device

Semiconductor device with multiple interconnect layers and vias

Method of semiconductor device and design supporting system of semiconductor device

Method of manfacturing semiconductor device

SANDISK TECHNOLOGIES LLC

Multi-tier three-dimensional memory device containing dielectric well structures for contact via structures and methods of forming the same

Three-dimensional memory device including bit lines between memory elements and an underlying peripheral circuit and methods of making the same

Cutoff gate electrodes for switches for a three-dimensional memory device and method of making the same

Three-dimensional memory device including sense amplifiers having a common width and separation

RENESAS ELECTRONICS CORP

Memory and logic device and method for manufacturing the same

Semiconductor device and layout design system

Semiconductor device and layout design system

Method of manufacturing semiconductor device

MITSUBISHI CHEM IND

Image-forming process, developer and image-forming system

Image readout element with oxytitanium phthalocyanine

Electrostatic developer and electrostatic developing method

NAGAO YUKA

Electrophotographic photoreceptor, and image forming device and electrophotographic photoreceptor cartridge using the same member cartridge

Electrophotographic photoreceptor and image-forming apparatus

Electrophotographic photoreceptor and image-forming apparatus

MITSUBISHI CHEM CORP

Electrophotographic copying process for reversal development

Electrophotographic photoreceptor

NEC CORP

Copper alloy for wiring, semiconductor device, method for forming wiring and method for manufacturing semiconductor device

SANDISK TECHNOLOGIES INC

Bridge line structure for bit line connection in a three-dimensional semiconductor device

WESTERN DIGITAL TECH INC

Three-dimensional memory device including crack-resistant backside passivation structure and methods of forming the same

TAKEWAKI TOSHIYUKI

Method of manufacturing semiconductor device

USAMI TATSUYA

Method of fabricating a semiconductor device

MITSUMORI TERUYUKI

Electrophotographic photosensitive body, image-forming device using same and cartridge