Inventor · disambiguated record
Jiro Kubota
Also filed as: KUBOTA JIRO
7 granted patents·2 pending applications·264 citations·filing 1996–2016
88Inventor score
Top patents by PatentIndex Score
9 records- 0196US6495397B2Fluxless flip chip interconnectionINTEL CORP·Filed 2001·Granted Dec 17, 2002·112 cites·23 claims
- 0285US7132311B2Encapsulation of a stack of semiconductor diceINTEL CORP·Filed 2002·Granted Nov 7, 2006·41 cites·27 claims
- 0383US9502368B2Picture frame stiffeners for microelectronic packagesINTEL CORP·Filed 2014·Granted Nov 22, 2016·5 cites·11 claims
- 0479US6030854AMethod for producing a multilayer interconnection structureINTEL CORP·Filed 1998·Granted Feb 29, 2000·60 cites·19 claims
- 0568US9685388B2Picture frame stiffeners for microelectronic packagesINTEL CORP·Filed 2016·Granted Jun 20, 2017·1 cites·11 claims
- 0668US7132739B2Encapsulated stack of dice and support thereforINTEL CORP·Filed 2004·Granted Nov 7, 2006·14 cites·18 claims
- 0766US5880530AMultiregion solder interconnection structureINTEL CORP·Filed 1996·Granted Mar 9, 1999·31 cites·14 claims
- 0837US2012112336A1Encapsulated die, microelectronic package containing same, and method of manufacturing said microelectronic packageGUZEK JOHN S·Filed 2010·Application pending·0 cites
- 0929US2002089836A1Injection molded underfill package and method of assemblyFiled 1999·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →