Inventor

KITAYAMA YOSHIFUMI

JP18 patents

⚠️ This page may combine multiple inventors who share the name “KITAYAMA YOSHIFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KITAYAMA YOSHIFUMI

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Method of forming a ball bond using a bonding capillary

Method of packaging electronic chip component and method of bonding of electrode thereof

Component affixing method and apparatus

Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor

Electronic chip component with passivation film and organic protective film

Method for bonding lead of IC component with electrode

Assembly of chip parts

Method for bump formation and its equipment

Semiconductor element having protruded bump electrodes

Semiconductor element having protruded bump electrodes

Electrode structure of a chip type electronic component

Bonding method of semiconductor device

Method and device for applying sealant to IC having bumps

MATSUSHITA ELECTRONICS CORP

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

BRIDGESTONE TIRE CO LTD

Tire component assembly

Strip deforming apparatus