Inventor
MINAMI MASAYOSHI
JP24 patents
⚠️ This page may combine multiple inventors who share the name “MINAMI MASAYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KOKUSAI ELECTRIC CORP
12 patentsUS10640869B2May 5, 2020
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP3 citations73
US11434564B2Sep 6, 2022
Method of manufacturing semiconductor device, substrate processing apparatus, recording medium and method of processing substrate
KOKUSAI ELECTRIC CORP2 citations72
US11885016B2Jan 30, 2024
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12195848B2Jan 14, 2025
Method of cleaning, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US11618947B2Apr 4, 2023
Method of cleaning, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US12406843B2Sep 2, 2025
Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations60
US12266522B2Apr 1, 2025
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations60
US11915927B2Feb 27, 2024
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations60
US11823886B2Nov 21, 2023
Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations60
US11361961B2Jun 14, 2022
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP1 citations60
US11728159B2Aug 15, 2023
Method of manufacturing semiconductor device, surface treatment method, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations59
US11257669B2Feb 22, 2022
Method of manufacturing semiconductor device, surface treatment method, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations59
HITACHI INT ELECTRIC INC
6 patentsUS7972979B2Jul 5, 2011
Substrate processing method and substrate processing apparatus
HITACHI INT ELECTRIC INC8 citations84
US9895727B2Feb 20, 2018
Method of manufacturing semiconductor device, method of cleaning interior of process chamber, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC3 citations73
USD791091SJul 4, 2017
Pattern wafer
HITACHI INT ELECTRIC INC5 citations73
US10081868B2Sep 25, 2018
Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC6 citations72
USD789311SJun 13, 2017
Pattern wafer
HITACHI INT ELECTRIC INC4 citations70
US10066294B2Sep 4, 2018
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC0 citations51
YAZAKI CORP
4 patentsUS5791084AAug 11, 1998
Method for making a gel of gel-coat seed easily disintegrable
YAZAKI CORP72 citations94
US5706602AJan 13, 1998
Method for making a gel coat of gel-coat seed easily disintegrable
YAZAKI CORP9 citations72
US5910281AJun 8, 1999
Method for restoring dried aqueous organic gel capsules
YAZAKI CORP3 citations61
US5701700ADec 30, 1997
Method for storing gel-coated seeds
YAZAKI CORP4 citations61