Inventor
HARPER JAMES MCKELL EDWIN
US22 patents
Patents
22 patentsUS6181012B1Jan 30, 2001
Copper interconnection structure incorporating a metal seed layer
IBM335 citations99
US5911619AJun 15, 1999
Apparatus for electrochemical mechanical planarization
IBM400 citations99
US5807165ASep 15, 1998
Method of electrochemical mechanical planarization
IBM476 citations99
US6399496B1Jun 4, 2002
Copper interconnection structure incorporating a metal seed layer
IBM94 citations98
US6063506AMay 16, 2000
Copper alloys for chip and package interconnections
IBM116 citations98
US5706067AJan 6, 1998
Reflective spatial light modulator array
IBM138 citations97
US6090710AJul 18, 2000
Method of making copper alloys for chip and package interconnections
IBM73 citations96
US6440851B1Aug 27, 2002
Method and structure for controlling the interface roughness of cobalt disilicide
IBM57 citations95
US6323130B1Nov 27, 2001
Method for self-aligned formation of silicide contacts using metal silicon alloys for limited silicon consumption and for reduction of bridging
IBM59 citations94
US5828131AOct 27, 1998
Low temperature formation of low resistivity titanium silicide
IBM60 citations94
US6753606B2Jun 22, 2004
Method and structure for reduction of contact resistance of metal silicides using a metal-germanium alloy
IBM13 citations92
US6331486B1Dec 18, 2001
Method and structure for reduction of contact resistance of metal silicides using a metal-germanium alloy
IBM21 citations92
US5912506AJun 15, 1999
Multi-layer metal sandwich with taper and reduced etch bias and method for forming same
IBM42 citations92
US6424388B1Jul 23, 2002
Reflective spatial light modulator array
IBM47 citations91
US6413859B1Jul 2, 2002
Method and structure for retarding high temperature agglomeration of silicides using alloys
IBM26 citations91
US7081676B2Jul 25, 2006
Structure for controlling the interface roughness of cobalt disilicide
IBM5 citations73
US7468766B1Dec 23, 2008
Reflective spatial light modulator array including a light blocking layer
IBM6 citations72
US6187679B1Feb 13, 2001
Low temperature formation of low resistivity titanium silicide
IBM9 citations72
US7102234B2Sep 5, 2006
Method and structure for reduction of contact resistance of metal silicides using a metal-germanium alloy
IBM3 citations63
US6809030B2Oct 26, 2004
Method and structure for controlling the interface roughness of cobalt disilicide
IBM2 citations62
US6503641B2Jan 7, 2003
Interconnects with Ti-containing liners
IBM5 citations62
US6346175B1Feb 12, 2002
Modification of in-plate refractory metal texture by use of refractory metal/nitride layer
IBM2 citations62