Inventor · disambiguated record
Jason R. Fender
Also filed as: FENDER JASON · FENDER JASON R
13 granted patents·3 pending applications·81 citations·filing 2005–2023
90Inventor score
Files withFREESCALE SEMICONDUCTOR INC5NXP USA INC3D'AMBROSIO RAIMONDO2UNIV WASHINGTON2FENDER JASON R1
Top patents by PatentIndex Score
16 records- 0191US9780090B2Integrated circuits and devices with interleaved transistor elements, and methods of their fabricationFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Oct 3, 2017·11 cites·15 claims
- 0286US9070683B2Die fracture detection and humidity protection with double guard ring arrangementFENDER JASON R·Filed 2013·Granted Jun 30, 2015·17 cites·20 claims
- 0377US9658971B2Universal SPI (serial peripheral interface)SPENCE NICHOLAS J·Filed 2013·Granted May 23, 2017·6 cites·16 claims
- 0477US9522081B2Methods and devices for brain cooling for treatment and/or prevention of epileptic seizuresD'AMBROSIO RAIMONDO·Filed 2012·Granted Dec 20, 2016·12 cites·39 claims
- 0576US10517755B2Methods and devices for brain cooling for treatment and/or prevention of epileptic seizuresUNIV WASHINGTON·Filed 2016·Granted Dec 31, 2019·3 cites·22 claims
- 0675US7339267B2Semiconductor package and method for forming the sameFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Mar 4, 2008·8 cites·20 claims
- 0773US8591562B2Methods and devices for brain cooling for treatment and prevention of acquired epilepsyD AMBROSIO RAIMONDO·Filed 2009·Granted Nov 26, 2013·14 cites·14 claims
- 0873US7723224B2Microelectronic assembly with back side metallization and method for forming the sameFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted May 25, 2010·7 cites·12 claims
- 0970US10318447B2Universal SPI (Serial Peripheral Interface)NXP USA INC·Filed 2017·Granted Jun 11, 2019·1 cites·14 claims
- 1059US12392821B2Thermal and electrical conductivity between metal contacts utilizing spring pin connectorsWOLFSPEED INC·Filed 2023·Granted Aug 19, 2025·0 cites·19 claims
- 1159US10366986B1Integrated circuits and devices with interleaved transistor elements, and methods of their fabricationNXP USA INC·Filed 2019·Granted Jul 30, 2019·0 cites·15 claims
- 1255US10283500B2Methods of fabricating integrated circuits and devices with interleaved transistor elementsNXP USA INC·Filed 2017·Granted May 7, 2019·0 cites·20 claims
- 1354US7935607B2Integrated passive device with a high resistivity substrate and method for forming the sameFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted May 3, 2011·2 cites·17 claims
- 1440US2018014971A1Thermally conductive graftUNIV WASHINGTON·Filed 2017·Application pending·0 cites
- 1539US2009236689A1Integrated passive device and method with low cost substrateFREESCALE SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 1635US2007090156A1Method for forming solder contacts on mounted substratesRAMANATHAN LAKSHMI N·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →