Inventor

CHAI TING-KE

TW3 patents

Patents

3 patents

US6555924B2Apr 29, 2003

Semiconductor package with flash preventing mechanism and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD27 citations87

US6359342B1Mar 19, 2002

Flip-chip bumping structure with dedicated test pads on semiconductor chip and method of fabricating the same

SILICONWARE PRECISION INDUSTRIES CO LTD37 citations86

US6650015B2Nov 18, 2003

Cavity-down ball grid array package with semiconductor chip solder ball

SILICONWARE PRECISION INDUSTRIES CO LTD12 citations68