Inventor
LAI JENG-YUAN
TW12 patents
⚠️ This page may combine multiple inventors who share the name “LAI JENG-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
10 patentsUS6369455B1Apr 9, 2002
Externally-embedded heat-dissipating device for ball grid array integrated circuit package
SILICONWARE PRECISION INDUSTRIES CO LTD149 citations99
US6282094B1Aug 28, 2001
Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD182 citations98
US6246115B1Jun 12, 2001
Semiconductor package having a heat sink with an exposed surface
SILICONWARE PRECISION INDUSTRIES CO LTD170 citations97
US6236568B1May 22, 2001
Heat-dissipating structure for integrated circuit package
SILICONWARE PRECISION INDUSTRIES CO LTD90 citations97
US6323066B2Nov 27, 2001
Heat-dissipating structure for integrated circuit package
SILICONWARE PRECISION INDUSTRIES CO LTD46 citations96
US7364948B2Apr 29, 2008
Method for fabricating semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD25 citations92
US7019389B2Mar 28, 2006
Lead frame and semiconductor package with the same
SILICONWARE PRECISION INDUSTRIES CO LTD23 citations88
US6501164B1Dec 31, 2002
Multi-chip semiconductor package with heat dissipating structure
SILICONWARE PRECISION INDUSTRIES CO LTD35 citations86
US7199453B2Apr 3, 2007
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD11 citations84
US6650015B2Nov 18, 2003
Cavity-down ball grid array package with semiconductor chip solder ball
SILICONWARE PRECISION INDUSTRIES CO LTD12 citations68